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精材科技股份有限公司
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精材科技股份有限公司
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Jobs
Category
All categories
Packaging Engineer
Quality Manager
CAD·3D Engineer
Equipment Engineer
Process Engineer
Product Engineer
Production Engineer
Location
Taiwan
Taoyuan City
Zhongli District
AOI工程師 (AOI Engineer)
1.AOI機台的程式撰寫、編輯和除錯2.分析檢測數據,協助改善製程3.與客戶及研發部門溝通,反饋問題並追蹤改善4.選擇與搭配合適的光源、相機、鏡頭等硬體組件5.通過AOI系統監控生產線,確保產品品質符合標準6.編寫技術文件和標準作業流程(SOP)7.品質教育訓練: 培訓生產線人員與跨部門同仁,提升全員品質意識與技能
WLCSP
Advanced Packaging
AOI工程師 (AOI Engineer)
1.AOI機台的程式撰寫、編輯和除錯2.分析檢測數據,協助改善製程3.與客戶及研發部門溝通,反饋問題並追蹤改善4.選擇與搭配合適的光源、相機、鏡頭等硬體組件5.通過AOI系統監控生產線,確保產品品質符合標準6.編寫技術文件和標準作業流程(SOP)7.品質教育訓練: 培訓生產線人員與跨部門同仁,提升全員品質意識與技能
2
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
1 years of experience required
No management responsibility
Career Changers Friendly
Return to Work
WLCSP
Advanced Packaging
Save
Apply Now
Save
Apply Now
SQE資深工程師 (SQE Senior Engineer)
1. Supplier quality management.2. New supplier quality management.3. Supplier audit.4. Customer incoming material report review improve.
WLCSP
Advanced Packaging
SQE資深工程師 (SQE Senior Engineer)
1. Supplier quality management.2. New supplier quality management.3. Supplier audit.4. Customer incoming material report review improve.
2
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
5 years of experience required
No management responsibility
Career Changers Friendly
Return to Work
WLCSP
Advanced Packaging
Save
Apply Now
Save
Apply Now
測試設備工程師 (Test Equipment Engineer)
1.擔任Tool owner,配合Process team長期改善actions2.帶領值班機況處理與解決3.專案事項處理4.其他主管交辦事項
FT
CP
測試設備工程師 (Test Equipment Engineer)
1.擔任Tool owner,配合Process team長期改善actions2.帶領值班機況處理與解決3.專案事項處理4.其他主管交辦事項
3
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
3 years of experience required
No management responsibility
Career Changers Friendly
Return to Work
FT
CP
Save
Apply Now
Save
Apply Now
製造管理工程師 (Manufacturing Engineer)
1.人員出勤管理及教育訓練2.產線物料優先次序排定3.生產管理、現場作業改善4.結構及生產力規劃資料分析統計與應用5.掌握產量進度6.提高產能及降低不良率
WLCSP
Advanced Packaging
製造管理工程師 (Manufacturing Engineer)
1.人員出勤管理及教育訓練2.產線物料優先次序排定3.生產管理、現場作業改善4.結構及生產力規劃資料分析統計與應用5.掌握產量進度6.提高產能及降低不良率
5
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
No requirement for relevant working experience
No management responsibility
Career Changers Friendly
Return to Work
WLCSP
Advanced Packaging
Save
Apply Now
Save
Apply Now
製程整合工程師 (Process Integration Engineer)
1.製程問題解決與分析2.良率改善3.專案改善規劃、執行(cost down, productivity)
WLCSP
Advanced Packaging
製程整合工程師 (Process Integration Engineer)
1.製程問題解決與分析2.良率改善3.專案改善規劃、執行(cost down, productivity)
3
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
No requirement for relevant working experience
No management responsibility
Career Changers Friendly
Return to Work
WLCSP
Advanced Packaging
Save
Apply Now
Save
Apply Now
製程工程師 (Process Engineer)
1.製程維護與改善2.製程問題解決與分析3.製程良率提升4.專案改善規劃、執行(cost down, productivity..)5.On duty
WLCSP
Advanced Packaging
製程工程師 (Process Engineer)
1.製程維護與改善2.製程問題解決與分析3.製程良率提升4.專案改善規劃、執行(cost down, productivity..)5.On duty
5
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
No requirement for relevant working experience
No management responsibility
Career Changers Friendly
Return to Work
WLCSP
Advanced Packaging
Save
Apply Now
Save
Apply Now
研發模組工程師 (R&D Module Engineer)
1. New process/ capability research development2. New tool/ material evaluation3. Transfer new technology to mass production
WLCSP
CoWos
Advanced Packaging
研發模組工程師 (R&D Module Engineer)
1. New process/ capability research development2. New tool/ material evaluation3. Transfer new technology to mass production
5
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
1 years of experience required
No management responsibility
Foreign Talents
Career Changers Friendly
WLCSP
CoWos
Advanced Packaging
Save
Apply Now
Save
Apply Now
封裝模擬工程師 (R&D Simulation Engineer)
1. SI/PI 模擬分析及參數優化2. S-parameter與 RLCG 莘取3. PDK資料維護,確保封裝設計符合系統需求4. 新技術前期的模擬評估及設計規劃
SI
PI
封裝模擬工程師 (R&D Simulation Engineer)
1. SI/PI 模擬分析及參數優化2. S-parameter與 RLCG 莘取3. PDK資料維護,確保封裝設計符合系統需求4. 新技術前期的模擬評估及設計規劃
1
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
2 years of experience required
No management responsibility
Career Changers Friendly
Return to Work
SI
PI
Save
Apply Now
Save
Apply Now
IC封裝設計工程師 (IC Package Design Engineer)
1. 各種產品的封裝佈局圖面繪製及客製化治工具設計2. 確保產品符合設計規範、品質標準與客戶需求 3. 建立檢測/驗證封裝的標準與流程4. 建立與維護設計平台及相關資料庫5. 新技術前期的模擬評估及3D模型建立6. 跨部門團隊合作,推動新產品開發與導入
AutoCAD
IC封裝設計工程師 (IC Package Design Engineer)
1. 各種產品的封裝佈局圖面繪製及客製化治工具設計2. 確保產品符合設計規範、品質標準與客戶需求 3. 建立檢測/驗證封裝的標準與流程4. 建立與維護設計平台及相關資料庫5. 新技術前期的模擬評估及3D模型建立6. 跨部門團隊合作,推動新產品開發與導入
1
・
Full-time
・
Entry level
Zhongli District, Taoyuan City, Taiwan
Negotiable
2 years of experience required
No management responsibility
Career Changers Friendly
Return to Work
AutoCAD
Save
Apply Now
Save
Apply Now
1
Semiconductor
1001 ~ 5000
台灣桃園市中壢區吉林路23號9樓
https://www.xintec.com.tw