R&D IIP Panel Process Engineer

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.

Responsibilities:

1. Advanced panel level packaging development for CoPoS technology.
2. Exploratory panel level packaging process/material/tool development for new applications.
3. Process stability/manufacturability improvement for yield and reliability qualification.
4. Responsible for transferring the process/material/tool for mass production.

1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, Optoelectronics, Mechanical Engineering, or a related engineering discipline.
2. Hands-on participation and a strong sense of ownership.
3. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models.
4. Growth mindset and open-minded communication.
5. Experience in solder joint, FCB, TCB; underfill dispensing; molding, grinding; temporary bonding/de-boning; sawing; and laser field.
6. Work Location: Zhunan; relocation to Longtan may be necessary depending on job requirements.

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.