SR ENGINEER, PACKAGE RELIABILITY

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions.

This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results.

You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification and GCP failures and prepare reports for discussion and escalation. You will also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation.

Successful candidate for this position will have:

Detailed knowledge of semiconductor component package assembly processes and challenges in particularly HBM and 3DS packages.
Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred.
Must be self-motivated, able to work independently, and detail oriented.
Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups.
Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc.

Education and Experience:

Minimum of BS degree or equivalent degree in Engineering (Electronics, Mechanical, Physics, Semiconductor, Materials) or related field of study.
Master’s degree in science (physics, statistics) and Engineering (Electronics, Mechanical, Materials) will be considered as well.
At least 2 years of working experience in PWF, DCA and 3DS packaging.
Qualification and Skills:

Knowledge in Micro Electronic Packaging, Quality and Reliability Engineering and Failure Analysis are preferred.
Knowledge of materials properties, applications, and materials characterization.
Experience in memory or related products in assembly, testing or reliability preferred.
Experience in data analysis and reliability modelling will be preferred.
Working level knowledge on HBM and 3DS packaging will be preferred.