1.Own end-to-end RF module/SIP development to bring products from concept to mass production
2.Responsible for module/SIP technology selection, part selection, vendor evaluation, and perform cost/technology/performance analysis
3.Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing
4.Perform simulation analysis (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs
5.Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level
6.Evaluate new advanced packaging technology, including design and validate prototypes
All around us, digital transformation is changing the way PEOPLE live, work, play and communicate. As a leading provider of semiconductor packaging and test services, ASE is playing a significant role in the development of the world’s most innovative electronics. Our technologies have also enabled our customers to create cutting edge products that deliver superior performance, power, speed and connectivity.