雅是達電子 | Principal Mechanical Engineer - in Singapore

Responsible for the design, analysis, testing, and manufacturing support of mechanical components in power conversion and plasma source products. Must be multi-faceted in all aspects of mechanical engineering and willing to take ownership of designs. Most important areas of expertise are heat-transfer and materials science.

Responsibilities:

• Independently prepares detailed and optimized mechanical designs of high power electronics packaging and vacuum chambers.

• Own the design and documentation of sheet metal, injection-molded, and machined parts.

• Participates in a multi-disciplined design team and is active in supporting new platform development activities. Design team interaction with Asia locations and within the US.

• Makes mathematical calculations to determine dimensional and positional variation (tolerance stackups) for mechanical components.

• Engineering simulation experience, including thermal, structure, and fluid-flow.

• Experiment design and data acquisition, such as temperature measurements, stress/strain measurements.

• Takes into account solid material properties, behaviors, and failure modes of: polymers, metals, and ceramics.

• Design and carry-out experiments to assess component durability or performance.

• Interacts with manufacturers to produce manufacturable and cost eƯicient parts.

• Considers method of fabrication during the design process – including maching, grinding and forming – in order to produce a manufacturable, optimized design.

• Provide guidance to Mechanical Designers and Drafters.

• Participates in the manufacturing and re-work of prototype parts, including 3D printing.

Experience:

• Bachelor’s Degree in Mechanical Engineering or Materials Science.

• Minimum of 5 years of related design experience.

• Advanced knowledge of Solid Works or other 3D modeling software.

• Must have a working knowledge of Geometric Dimensioning and Tolerancing per ANSI Y14.5.

• Experience in thermal analysis, hand calculations, and engineering simulation software. Ansys preferred.

• Experience with plasma processing and maufacturing, knowledge of materials, purity, cleanliness required for semiconductor wafer processing.

• Demonstrated experience with vacuum equipment as applied to plasma processing.

• Knowledge of materials science to design parts to withstand harsh plasma environments.

• Working knowledge of manufacturing process in metal machining, sheet metal, injection molding.

• Expertise in thermal instrumentation and experimental design validation.

• Prefer ability of scripting in Python or Matlab to support data acquisition and design simulation.

• Prefer experience in developing anodization for corrosive atmospheres.