Cari Lowongan

*有品保相關工作經驗者，優先安排面談*此專案簽約一年，到期視情況另有其他方式留下，為長期職務。●享有福委會福利●期滿另有獎金1.監控和改進產品或產線生產過程的品質，檢測產品或材料，確保產品質量2.品質相關的處理追蹤與聯繫(不良分析、8D報告撰寫)、品質管理/分析

*此專案簽約一年，到期視情況另有其他方式留下，為長期職務。●享有福委會福利●另有獎金*保證起薪達4萬元以上!!*無經驗者可，細心者尤佳 *精密零件組裝 *無塵室工作(須著無塵衣、護目鏡)*工作時間：前期為周一~周五常日班別09:00-18:00(後續視生產狀況需配合假日加班或輪班)1. 零件組裝作業 (使用螺絲起子等手工具，將金屬零件鎖至機械結構上面)2. 工作環境會使用到濃度低化學藥液，使用治具將零件泡浸藥液洗淨後拿起

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Facility Computer Integrated Manufacturing Department (FDCIM) is part of the Intelligent Manufacturing Center (IMC) at TSMC. It is primarily responsible for the development and maintenance of the following products: Development and maintenance of manufacturing-related report products for wafer fabs.Development and maintenance of engineering-related report products for wafer fabs.Development and maintenance of digital operation system products for facility management.Development and maintenance of big data application system products for facility management.Development and maintenance of facility management AI and machine learning related algorithm development and application system products. Responsibilities: FDCIM also employs software engineering and modular development techniques, combined with high-performance database application technologies, to develop systematized software with a unified version control system that accommodates different time zones and languages globally.In addition to its regular software product development work, FDCIM is also engaged in the research and development of new technologies, including the application of DevOps, Microservices, MLOps, AIOps, and more. Develop and maintain AI/ML systems and algorithmsCollaborate with cross-functional teams to identify and solve business problems using AI/ML techniquesDesign and implement machine learning models and data pipelinesTest and validate AI models for accuracy, scalability, and efficiencyDeploy AI solutions to production environmentsStay up-to-date with the latest advancements in AI technologies and industry trendsWrite clean and efficient code using HTML, CSS, and JavaScriptOptimize web applications for speed and scalabilityTest and debug web applications across multiple browsers and devicesStay up-to-date with the latest front-end development trends and best practices

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

[Job Description] 1.AI 工作流整合： 設計並實施端到端的 AI 自動化流程，將 AI 能力無縫串接至企業現有的系統（如 ERP, CRM 或 SaaS 系統）。 2.客製化解決方案交付： 深入分析客戶或內部單位的業務需求，設計量身打造的 AI 應用，解決客戶痛點。 3.推論經濟與效能優化： 監控並優化 AI 的推論成本（Token 消耗）與回應速度，在混合雲或邊緣環境中尋求成本與效能的最優解。 4.技術諮詢與導入支援： 擔任技術橋樑，將複雜的商務邏輯轉化為技術規格，並提供持續的提示詞調優與技術支援。

負責分析AI算法在實際系統架構運行時的效能瓶頸。 AI 應用成為近幾年的主流，軟體服務的效能依賴於幾個重點：系統架構設計、演算法的實作、硬體規格。 過去為了提升協作開發效率，計算機領域主要朝著抽象化的方式，降低各層互相的耦合性。 然而，這其中的權衡奠基在過去硬體隨著摩爾定律效能快速的成長，在大型系統中往往能藉由過剩的硬體效能彌補抽象化造成的損失。 然而，AI 時代迎來模型參數和運算需求指數成長的情況，這是少數已經具有商業價值需求的算法，超出現有硬體算力需求的狀況。 所以，以整體作為優化的研究，成為當前相當具有價值的工作。縱向的打破各層之間的抽象，找出不同實作之間能獲得最佳效能的搭配。 1. 基於演算法(多為平行運算)估算運算複雜度和空間使用量 2. 基於硬體配置，估算演算法在系統上的理論表現 3. 設計 DOE 實驗，驗證實際數據與理論數據的誤差 4. 基於實驗結果，找出演算法、軟體實作、系統、硬體的瓶頸 5. 實作優化算法，藉由實驗結果和理論分析證明其有效性 6. 撰寫技術文件，提供應用服務端作為實作參考。The responsibility involves analyzing performance bottlenecks of AI algorithms during operation within actual system architectures. AI applications have become mainstream over recent years. The performance of software services relies on several key factors: system architecture design, algorithm implementation, and hardware specifications. In the past, to improve collaborative development efficiency, the computing field primarily focused on abstraction to reduce coupling between different layers. However, this trade-off was based on the rapid growth in hardware performance driven by Moore’s Law. In large systems, excess hardware capabilities often compensated for losses caused by abstraction. However, the AI era brings exponential growth in model parameters and computational demands. This situation occurs with only a few algorithms that already possess commercial value requirements, exceeding existing hardware computing capabilities. Therefore, research focusing on overall optimization has become highly valuable work. Breaking down vertical abstractions between layers to identify optimal combinations among different implementations becomes essential. Estimating computational complexity and space usage based on algorithms (mostly parallel computing)Estimating theoretical performance of algorithms on systems based on hardware configurationsDesigning DOE experiments to verify discrepancies between actual and theoretical dataIdentifying bottlenecks in algorithms, software implementation, systems, and hardware based on experimental resultsImplementing optimized algorithms, demonstrating their effectiveness through experimental results and theoretical analysisWriting technical documentation to provide application service providers with implementation references.

●AI Core ◎檢索增強生成 (RAG)： 熟悉 Embedding Model 微調、chunking, Vector Databases (如 Qdrant, Milvus 或 Pinecone) 的應用與 Indexing 策略。 ◎模型評估與優化： 具備 Rerank 演算法實作經驗，能針對 RAG 的檢索準確度進行定量分析 (如 Hit Rate, MRR)。 ◎多模態與 OCR： 熟悉 VLM (Vision Language Models) 與 OCR 流程，能處理複雜單據的解析與結構化資料提取。 ◎LLM 微調： 了解 SFT (Supervised Fine-Tuning) 與合成資料生成技術。 ◎AI Agent : 了解AI Agent 架構, 了解Skill / Tool-use 與 Task Planning。 ●Software System Architecture Design ◎前/後端開發： 精通 Python (FastAPI / Flask)或是C#，UI/UX (Vue3/HTML )，具備 RESTful API 設計與非同步程式設計經驗。 ◎系統設計： 具備 Multi-user 架構設計能力，熟悉帳號權限 (RBAC)、日誌系統 (ELK/Loki) 與資料庫設計 (SQL/NoSQL)。 ◎高效能通訊： 熟悉網路協議與分散式通訊，如 TCP/IP、NATS 或 gRPC。 ◎中介軟體： 熟悉 Redis 快取機制，用於處理高併發請求或 Session 管理。 ●推論優化與維運 (Inference Ops) ◎推論引擎： 熟練使用 vLLM, llama.cpp, Ollama 或 OVMS 進行模型佈署與加速。 ◎硬體知識： 了解 GPU/NPU 架構，能評估 TOPS、KV Cache 佔用對推論延遲與吞吐量的影響。 ◎容器化與編排： 熟練 Docker / podman 操作，並具備 Kubernetes (K8s) 基本概念，能管理大規模容器化應用。

1.培育未來職位:直營店店長/支援儲備店長2.訓練期間：1年~1年半，依個別實際訓練狀況而定。3.訓練階段：從門市銷售服務、倉儲商品管理、賣場經營、各式器具設備及環境清潔維護，經店舖間輪調以配合店舖實際歷練與總部訓練課程，透過門市職員、副店長、店長職務歷練，各班別早、晚、大夜班店舖基礎輪調訓練，儲備店舖專業知識與技能。4.工作內容：*提升店舖商品訂購能力與銷售技巧，以達成店舖營業績效*店舖規劃與執行商圈活動，以經營店舖商圈*保持店舖商品陳列豐富，維持商品結構*訓練店舖人員能力、分配店舖人員任務，以達成店舖績效*店舖形象維護，提供整潔、明亮、安全之良好優質環境*應徵職務為支援儲備店長者，須於各加盟店與直營店間支援

1、裝機、驗機、與機台之維修改造。2、機台售後服務事項之辦理。3、與工廠及客戶端之協調、問題反應與解決。4、SOP之撰寫。5、需配合國外出差、加班、輪班。※出差津貼、輪班津貼另計1..具半導體機台維修經驗尤佳2.能配合出差、輪班(三班制：早08:00~17:00、中16:00~01:00、晚00:00~09:00、每2月輪一次)3.具基礎Microsoft電腦文書處理能力4.需具備交通工具：汽車5.需配管，水或電相關證照尤佳6.依實際學經歷敘薪

***各職缺在面試通過後會再依居住縣市地區附近分發***◎職務名稱：專職大夜、支援大夜◎工作內容：專職大夜：主要於直營店間輪值夜班，值班期間主要工作如下：1.收銀結帳2.顧客服務3.商品整理4.店舖及機台清潔5.商品進貨整理6.店舖主管交辦之事項支援大夜：主要協助支援加盟店臨時或短期大夜職缺，若無加盟店大夜支援職缺，則安排至直營店鋪輪值夜班，值班期間主要工作如下：1.收銀結帳2.顧客服務3.商品整理4.店舖及機台清潔5.商品進貨整理6.店舖主管交辦之事項◎工作分發地區：各職缺在面試通過後會再依照居住地附近分發◎工作時間:23：00~07：00(可能因店鋪實際運作狀況進行微調)◎薪資福利制度：1.採契約制，專職大夜月薪34,500元起、支援大夜月薪37,000元起。2.契約期滿有約滿獎金6,000元。3.約滿後如經主管同意續約，另有續約獎金6000元。4.福利：享勞健保、勞退、團保、三節禮券、生日禮券、生日假、勞動節禮券等。