Cake 找工作

我們是一家穩健成長的科技公司，長期深耕醫療產業並持續擴展數位服務版圖。近年積極投入系統現代化與雲端轉型，導入新一代架構與開發流程，並逐步推動測試自動化與工程化。團隊重視產品穩定性與使用體驗，QA在組織中扮演關鍵角色，直接影響產品品質與交付效率。這是一個能從「執行測試」走向「品質工程」的機會，適合希望提升技術深度與影響力的QA人才加入。 【工作內容】撰寫測試計畫、測試案例與測試腳本執行軟體與硬體整合測試導入與維護自動化測試框架將測試流程整合至 CI/CD pipeline進行缺陷追蹤、分析與驗證建立測試環境並優化測試流程

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。儲備製程副工程師職位旨在培育工程專業人才。您將接受至多12個月的訓練課程，通過考核後正式擔任製程副工程師。若考核未達要求，公司將提供指導與進行績效改善計畫，幫助您提升技能。如最終未達目標，公司將與您共同商討下一步職涯規劃。職務說明: 1. 具備積極學習動力，並擁有紮實技術背景與能力，能維持邏輯晶片產品的製程技術。 2. 具備高度團隊合作能力，包含與元件、整合、良率提升、曝光、蝕刻、薄膜領域之間的溝通協調。 3. 負責日常操作的維護工作，包括與設備工程師合作進行機台設備故障排除與復歸，並指導技術人員操作。 4. 依公司需求配合假日排班輪值，實際安排將依工作需求及培訓進度調整。

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.The Infrastructure and Platform Engineering Department (IPED) in TSMC's Intelligent Manufacturing Center (IMC) is dedicated to enhancing system stability and developer productivity. As TSMC's production scale continues to expand, the core focus is on smart manufacturing through deep system integration to maintain high yield and efficiency. Within this team, you will assist in implementing new cloud architectures (K8S) and other related cloud-native technologies to achieve the goals of DevOps. General job responsibilities for this job position are: Develop and maintain cloud-native related systems based on the K8S architecture.Tune system configurations based on metrics and user feedback.Work closely with internal development teams and seek new tools that can enhance productivity.Conduct POC (proof of concept) and assist internal development teams with implementation.

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results. You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification and GCP failures and prepare reports for discussion and escalation. You will also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation. Successful candidate for this position will have: Detailed knowledge of semiconductor component package assembly processes and challenges in particularly HBM and 3DS packages. Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred. Must be self-motivated, able to work independently, and detail oriented. Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups. Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc.

As a DRAM Engineering Group (DEG) Product Engineer at Micron Technology, Inc., you will be responsible to prepare for new DRAM products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run simulations, create and maintain design documentation, analyze parametric data and respond to failures. In this role, you will work with various Engineering and Manufacturing groups to troubleshoot, develop and validate device testing programs, as well as identify and validate lab equipment needs, and identify or modify tests for customer returns and programs to meet specific product requirements. You will also act as a product-specific point of contact and work with Application Engineers evaluating and providing feedback on data sheets, and with Quality Assurance to ensure product reliability.

As a Senior or Principal Engineer, Instrumentation & Controls for the Global Facilities Engineering department at Micron Technology, Inc., you will be responsible to provide Engineering system ownership and technical support for the planning, design, construction, operations, and maintenance programs of the critical Facilities systems. In this role, you will support the Micron Semiconductor Manufacturing sites across the network, including Facilities and Manufacturing teams, through all phases of design, construction, installation, start-up, operations and maintenance with focus and emphasis on Global Standardization and Alignment, Innovation, Reliability and Performance, and Sustainability. The Facilities system ownership and responsibilities include for the I&C, FMCS, SCADA, Life Safety Systems, Toxic Gas Monitoring, Telecom, and Security systems, as well as the Controls interfaces with other Facilities Mechanical, Electrical, Process, and Building systems. This role will also lead the Facilities Digitalization and SMART Facilities program initiatives. Provide Technical Support, Leadership, and Expertise Provide consultation and support to Global, Regional, and Site Facilities and Manufacturing teams as the Technical Field Domain Expert.Collaborate with internal partners and collaborators including Technology Development Team, Procurement, Finance, Legal, etc.Analyze system designs to identify improvements that will result in better performance, efficiency gains, reduced maintenance, and cost savingsSupport sites with problem analysis using standard tools and methodologies as requestedBenchmark within and external to Micron sites on Engineering Best Practices and Best Known Methods (BKM) of Facilities buildings and systemsMaintain technical knowledge domain expertise on your respective subject area including for Industry Standards and Best Practices, Trends and Technological advances, emerging technology roadmap, Design Innovations, Sustainability, Digitalization, etc. Provide Design and Construction Project Support, Leadership, and Expertise Support the Micron Global, Regional, and Site Design and Construction project teams in the Engineering and Design development for new large-scale, Facilities Infrastructure Expansion projectsDevelop, review, and maintain the Micron Global Design and Construction Standards and Construction Specifications with focus and emphasis on Engineering Design and Construction of your respective systems.Develop the system design concepts for your respective field systems to be deployed into the Design and Construction Projects, including for Control System Architecture, System P&IDs, Sequence of Operations, and Functional Description of System OperationsEnsure that project scope meets customer and requestor needsEnsure appropriate communication and collaboration with Facilities, Design, Construction, Procurement and Manufacturing stakeholders, to deliver project objectives and resultsPerform timely review of design packages and providing documented comments and feedback as necessary. Ensure designs are in compliance with all standards, codes, and regulationsMonitor progress and provide Engineering and Design support during construction projectsProvide support for project cost and schedule estimates and justification for approvalProvide supervision and coordination of Consultant resources Review capacity planning databases and system operating trends across the network and validating utilization and diversity factor assumptionsParticipate and/or lead capacity and scenario planning across the network, including evaluation of system and distribution capacity impacts based on scenario changesReview and advise on scope, schedule, and cost estimates for Facilities infrastructure additions or modifications Provide Global Initiatives Program Support, Leadership, and Expertise Develop, review, and maintain Micron Global Best Known Methods (BKM) documents with focus and emphasis on Operations and Maintenance Reliability and/or PerformanceLead & own the Global Facilities Programs & Initiatives, including establishing and defining the program objectives, roadmaps, and high-level implementation planLead the Global Facilities Digitalization and SMART Facilities Programs in support of Micron’s Corporate Digitalization goals and initiativesLead the Global Facilities Sustainability Programs in support of Micron’s Corporate Sustainability goals and initiativesCollect and consolidate Lessons Learned and feedback from Micron Global, Regional, and Site teams to incorporate into the Micron Global Standards and BKMs

A High Bandwidth Memory PMO (Program Management Office) Program Manager at Micron is responsible for the development of industry leading High Performance memory products (HBM) used in various markets and applications! The HBM PM oversees projects from the planning stage through qualification and product ramp in accordance with Micron’s Product Lifecycle Management (PLM) process. The HBM PM will work with the PDT to develop, qualify and ramp the next-generation groundbreaking HBM products! In this position, the individual will also be responsible for achieving the HBM program targets captured in the project release document (schedule, samples delivery, quality, cost, manufacturing readiness, ramp readiness), and for directing the Product Development Team (PDT). The HBM PM will be the key interface between CNBU, Design, DEG, Manufacturing, Test, APTD, Global Supply Chain and Global Quality departments Responsibilities include, but are not limited to: Capture HBM product requirements in close cooperation with the respective BU (Business Unit) representative.  Drive an alignment process of product development targets with Engineering, RD and BU  Establish a ProChain(TM)  based project schedule as the single source of truth   Ensure cross-functional teams’ consensus on availability of resources required to achieve the goals of the project and drive towards closing executional gaps. Ensure cross-functional teams’ consensus on availability of resources required to achieve the goals of the project and drive towards closing executional gaps.   Build and cultivate strong working relationships with key HBM functional areas and PDT organizations to constantly drive towards delivering HBM stage gates commitments. Strong communication and team-working skills are crucial, with proven track record to lead and influence. Proven experience inspiring change and working across functions and geographies to deliver products to specific critical metrics Communicate HBM product vision clearly to PDT team members and key partners and encourage actions to deliver HBM products to our key customers prior to competition definitions Work with the Supply Chain representative on a sample delivery plan for engineering and qualification samples. Communication and collaboration with your DEG/APTD team as well as other multi-functional teams will be crucial to your success. Drive and contribute to project kickoff ahead of project schedule builds to ensure all requirements and assumptions are identified.   Provide balanced advocacy of both Micron internal teams, as well as customer/BU requests to ensure project success in varying development scenarios. Project execution: Establish and advise the PDT. This includes regular (typical: weekly) meetings of the PDT and to track the progress of the project. Set the pace, focus, and intensity of the entire team. The PM serves as the conscience of the PDT: No important issues are ducked or dissembled; the earlier issues are raised the better. Monitor the project plan (includes weekly ProChain(TM) task updates): Drive and supervise required actions and follow ups especially when the execution of the project is off schedule. Decision making: Identify and quickly make decisions. Advance decisions that are beyond the scope of the PDT in a timely fashion. Solve conflicts and set priorities to reach project goals.  Ongoing and active risk and change request management.  Participate actively in stage gate reviews according to the project schedule. Drive product qualification and ramp as well as hand-off to Manufacturing/Supply Chain.  Regular (weekly) reporting of the program status to Engineering Management and to the lead BU. Coordinate and lead report outs at work reviews and program reviews. Lessons learned workshops to ensure proliferation of knowledge and best practices across the company.  The Program Manager reports to the Senior manager of the DRAM HPM PMO organization.

This is a global role in the Global Quality organization. Our organization specializes in building business processes that supports Micron's strategic objectives and fulfills international standards and customer requirements. We are looking for a highly driven individual to lead and drive network alignment and enable consistent execution of the NPI (New Product Introduction) process across Frontend and Backend. The successful candidate will be responsible for leading a team of global NPI process owners across Frontend and Backend, driving alignment across network and spearheading process improvement activities. They are expected to collaborate closely with leadership and process sponsors, to achieve best-in-class NPI process. The successful candidate must be driven and motivated to independently drive process improvement activities, able to lead cross-functional project teams to achieve desired outcomes. They must also be able to communicate changes and assess impacts to global NPI processes. They must also be able to effectively articulate the NPI process during internal and external audits. This position requires a good grasp of both frontend and backend manufacturing processes, and a good understanding of process and project management, as well as basic understanding of external standards such as APQP, IATF 16949 and ISO 9001. The candidate must be able to communicate well and able to collaborate effectively across a large cross-functional team. The candidate will be required to assess gaps in very dynamic situations and make quick and sound decisions that protects Micron's business and customers. Responsibilities and Tasks (include, but not limited to): Lead effort to define the intent and scope of the process, and how it relates to the organization’s strategy. Establish process-performance measures and measurement methods, communicate process performance measures. Lead business process review and ensure business process meets the required content and are communicated to process stakeholders. Provide governance for business processes, aligning with best methods and tools, and driving process excellence. Accountable to communicate timely on major changes of the process or where there are presence of non-conformities or new CSRs, etc and identify the need to conduct additional System Level Business Process Reviews. Manage business process improvement roadmap and activities, ensure proper communication on process changes. Lead efforts to improve overall cross-functional performance analysis. Risk Based Thinking - Promote risk-based thinking (RBT) and manage risk within the process, aligned to the requirements of the Global Quality QMS Process Risk-Based Thinking Standard. Manage risk using the RBT App and monitor and update risks, treatments, and contingency plans as applicable. Process Management - Promote the benefits of the process-based management approach via exemplary management of the process. Identify training needs for key process performers. Accountable for interpretation and deployment of the Customer Requirements to applicable locations and sharing the new CR during BPR. Develop and maintain process artifacts. Make certain that process continues to perform to requirements for its stakeholders. Provide process metrics and improve performance results. Report performance to the stakeholders. Coordinate business process improvement activities to maintain competitive edge. Articulate NPI process during internal and external audits. Identify opportunities for improvement and drive CIP activities accordingly.

As a member of the HIG HBM Media Health HVM team you are requsted to desmonstate the mindset of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives. Key Responsibilities Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing. Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market. Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products. Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies. Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets. Root Cause and Resolution of Qual and RMA Device Issues Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies. Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability. Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, Test Program Development and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Requirements Bachelors/Masters Electrical Engineering Degree with 5+ years of experience in the semiconductor industry. Micron and Product Engineering Experience is preferred. Demonstrating Strong Leadership Skills and Technical Skills 5+ years of experience in the semiconductor industry. Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Preferred professional skills: Programming skills/experience (Python a plus) Logic gate and transistor operation knowledge Circuit simulation or circuit debug skills/experience Familiarity with DRAM operation a plus Semiconductor process knowledge a plus

As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) Engineer at Micron Technology, Inc., you will be responsible for enable customer dpm reaching BIC and minimize CoNC. As a DRAM product lead, involving product qualification, deviation material disposition, OQRM management and customer dpm monitoring, dpm reduction. Responsibilities and Tasks Provide Qualification plan, review and release qualification Define outgoing quality and reliability sampling and test plan Monitor OQRM from FAB, ASM, BE, MODULE for HVM product. Dispo deviation materials. Time to dispo. Inventrory reduction, rescreen and rework to minimize the CoNC. Review internal quality metric and drive customer DPM to BIC. Data mining and correlation all inline test data. Root cause finding and drive CA/PA. Education Required Associates Degree or equivalent experience Solid State Electronic Devices MOSFET, CMOS Process Related field of study Experience Desired experience in each of the following: Semiconductor Manufacturing DRAM Fab Product QA DRAM Product Engineer DRAM Yield Engineer